Infineon marks innovation milestone with world’s first 300-millimeter power silicon carbide (SiC) wafer
PBusiness & Financial Press
Nov 09, 2026
Infineon presents industry-first functional power devices processed on 300-millimeter silicon carbide wafers
Technological breakthrough underlines Infineon’s innovation strength and leadership in power semiconductors and wide-bandgap technologies
300-millimeter SiC process feasibility lays the foundation for secure, future-proof SiC supply to customers in automotive, renewable energy, industrial and AI data center applications
Infineon will present the first processed 300-millimeter SiC wafer to the public at the electronica trade show starting 10 November 2026 in Munich
Infineon marks innovation milestone with world’s first 300-millimeter power silicon carbide (SiC) wafer
PBusiness & Financial Press Nov 09, 2026
Infineon presents industry-first functional power devices processed on 300-millimeter silicon carbide wafers
Technological breakthrough underlines Infineon’s innovation strength and leadership in power semiconductors and wide-bandgap technologies
300-millimeter SiC process feasibility lays the foundation for secure, future-proof SiC supply to customers in automotive, renewable energy, industrial and AI data center applications
Infineon will present the first processed 300-millimeter SiC wafer to the public at the electronica trade show starting 10 November 2026 in Munich
The primary players are South Korea, Taiwan, the US, and China and most of their capex in the space is in Asia and the US.
You can likely live without a new gaming rig. You likely cannot live without replaceable parts for trucks and cars.